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Home arrow News arrow Exhibitions arrow The ETC Hosts Universities and Research Laboratories at IMTS 2008
The ETC Hosts Universities and Research Laboratories at IMTS 2008 Print E-mail
Written by Anand   
Saturday, 05 July 2008
The ETC – Emerging Technology Center will have university & research laboratories exhibit their new technology research and development efforts in science-based manufacturing and innovative process developments.

Machine Dynamics Research Lab (Booth B-1007)
The Penn State Machine Dynamics Research Lab will spotlight a system that senses the force generated during precision grinding.

Difficult precision grinding and micro milling challenges may be solved using high quality instrumentation for real-time process monitoring and control. To meet this need, the lab has developed instrumented spindles with embedded capacitance gages to provide real-time force feedback with milli-Newton resolution. This technology is being used to optimize the grinding of difficult materials such as hardened stainless steel, silicon and various ceramics. The benefit of this system is improved process control and more accurate parts.

University of New Hampshire (Booth B-1016)
The Smart Tool Holder developed by the University of New Hampshire mechanical engineering department is a robust real-time sensor interface system that can provide tool tip sensor data for process condition monitoring during metal cutting. Condition monitoring includes tool wear, run-out, and system stability evaluation. The Smart Tool Holder allows accurate determination of NC metal cutting system dynamics so cutting forces and, ultimately, part quality can be estimated in-process. To solve this problem, a wireless sensor system has been developed for non-invasive integration into commercial cutting tool holders. This wireless sensor system combines existing robust hardware technologies in a novel application. Electret-based accelerometers are used as the sensors. The system is plug-and-play with modern PC hardware.

TechSolv, Inc. (Booth B-1021)
TechSolve will be highlighting its Smart Machine Platform Initiative (SMPI) project and three demonstrations of MTConnect monitoring conditions on the SMPI test-bed in Cincinnati, Ohio.

During IMTS 2008, TechSolve will be conducting the following three demonstrations using the MTConnect standard:

1) Connect to the SMPI test-bed in Cincinnati, Ohio and monitor parameters through the MTConnect protocol.
2) Use the MTConnect compliant Probe Direction Analyzer (PDA)., developed in Java, records and displays the real-time X, Y and Z coordinates of the probe and calculates the instant positive, negative, or idle direction of movement based on the user-defined polling rate.
3) Use the MTConnect-enabled WatchDog Agent to monitor spindle bearing degradation.

The Smart Machine Platform Initiative (SMPI) is a multi-year effort focused on "First Part Correct" manufacturing capabilities and technologies to strengthen the U.S. manufacturing base, national security, and overall economy. During the first year of the program, which ended in December, 2007, TechSolve was able to deploy the test-bed, integrate the technologies on the test-bed, and successfully validate, demonstrate, and disseminate initial information to manufacturers on the seven SMPI technologies which include:

1) Tool Condition Monitoring: determines the state of the cutting process and adapts to an optimal solution, enabling improved part quality and consistency.
2) Intelligent Process Planning: simulates and optimizes the machining process.
3) Machine Tool Metrology: identifies machine tool positioning capabilities.
4) On-Machine Probing: inspects the fixture and part/component in-process.
5) Machine Tool Health and Maintenance: utilizes prognostic tools to assess the health of the machine tool and its components.
6) Intelligent Machining Network: an intelligent, closed-loop system that integrates and manages the manufacturing process.
7) Supervisory System: a knowledge base that coordinates process monitoring and control for overall optimization of the machining process.

TechSolve is currently linking independent technologies to provide a seamless interface between the pre-process and in-process technologies. This seamless communication is a critical link in transitioning Smart Machine subsystems into a complete, fully operational, and optimized system. In the third year of the SMPI program, TechSolve will be working with its partners to integrate and link the Smart Machine subsystems into a fully operational and optimized Smart Machine System. This system will be capable of producing an optimized pre-process manufacturing plan while validating the subsequent execution of this plan.
University of Kentucky (Booth B-1011)

The researchers at the University of Kentucky will demonstrate economic, environmental and societal benefits of implementing sustainable manufacturing. The focus is machining, forming and brazing processes that have exhibited significant advantages in sustainability principles. The University of Kentucky will highlight the latest advances in research including energy-efficient, toxic-free, waste-minimized, emission-reduced, safe, secure technologies that will promote the 6Rs (reduce, reuse, recycle, recover, redesign and remanufacture) of sustainable manufacturing and cover all four stages of product life cycle (pre-manufacturing, manufacturing, use and post-use).

University of Florida Machine Tool Research Center (Booth B-1017)
The Machine Tool Research Center at the University of Florida will showcase two of its machining initiatives.

The first is milling profit optimization. Decision theory principles are applied to milling models to make rational decisions about operating parameter selection. They will also show the results of continued efforts in the prediction of tool point dynamics for use with milling models. The development of this dynamic prediction capability reduces the number of impact measurements that must be completed in order to characterize the dynamic response of arbitrary spindle-holder-tool assemblies and enables the user to select successful operating parameters at the process planning stage. Progress on the extension of the method to micro end-mills, which cannot be conveniently measured by tradition means, will also be demonstrated.

The second initiative is new capabilities in magnetic field assisted finishing. By controlling the magnetic field, the motion of magnetic tools enables finishing of both easily accessible surfaces and those that are hard to reach by conventional mechanical techniques. This is a distinct advantage of the magnetic field assisted machining process and achieves nano-scale mirror-finish surfaces of capillary tubes, bent tubes, and free-form components, to name a few. A prototype machine for internal finishing of tubes will be exhibited to demonstrate the process feasibility.

Also participating in the ETC will be the American Society for Precision Engineering, the Industrial Diamond Association. of America, the University of Toledo/College of Engineering, the University of North Carolina at Charlotte, the University of Illinois, the Manufacturing Automation Laboratory, the Georgia Tech Manufacturing Research Center MaRC/PMRC and the University of California at Berkeley.

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