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Home arrow News arrow Business News arrow Messung Systems invests Rs. 10 million in new machinery at Pune facility
Messung Systems invests Rs. 10 million in new machinery at Pune facility Print E-mail
Written by Vivek   
Thursday, 05 May 2011
Pune: Messung Systems has invested Rs. 10 million in new machinery at it's facility in Pune. The company has added a Heller Make 1809 Mark III series 'Reflow Oven' for RoHS compliant SMT based PCB soldering to their shop floor.

With a current capacity of manufacturing 1,00,000 PCBA units annually Messung Systems aims at increasing the capacity to 2, 00,000 PCBA units per annum with the new complete automatic SMT line.

In order to increase the productivity and set up World Class Manufacturing (WCM) for highly reliable PCBA manufacturing, Messung Systems has installed a Juki make Pick & Place machine, fully automatic EKRA XPRT-5 solder printer, in line 2.5D inspection facility and automatic PCB loader. The addition of this Reflow Oven , completes the automatic SMT Line, eliminating manual operations in PCBA manufacturing.

"It was time to modernize the plant and bring in world class machinery that enhances efficiency and prompt delivery. Installation of Heller Reflow Oven will ensure excellent soldering and bonding quality. The machine saves resources and allows very high production speeds. It also expands our PCBA processing capability, thereby improving competitiveness while reducing opportunities for human error," said Farook Merchant, Chairman & Managing Director, Messung Group of Companies.

Messung has been working with indigenous PLC technology in the automation industry in India since 1981. The company is also a distributor for Mitsubishi Electric's range of Factory Automation (FA) products since 1995.

Messung provides factory automation products such as PLCs, VFDs, HMIs and Servos from Mitsubishi Electric - Japan and international standard PLCs manufactured by Messung for their customers.

The Reflow Oven has 18 independent Temperature Controlled 350 Deg C Balanced Air Flow "Lead Free" Heating Zones and followed by 2 cooling zones to increase productivity. The PID controllers ensure temperature stability to +/-1 Deg C along with computer based Profile measurement and storage systems. Use of Nitrogen option in the process helps to reduce the oxidation during heating process and offer better solder bonding. Enhanced heater modules "blanket" the PCB with heat for the lowest Delta-Ts on the toughest hi-density boards. Additionally Uniform Gas management system eliminates net flow which results in up to 40% reduction in nitrogen consumption. The special frame structure utilizes dual insulation reducing heat loss and saving up to 40% electricity costs.

Devdatta Hambardikar, President - Messung Systems unveiled the new machine amongst the senior management and employees. This new system installed for the first time, has been successfully set into operation.

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