The Union Cabinet of the Government of India has approved four new semiconductor manufacturing projects with a total proposed investment of about INR 46 billion in Odisha, Punjab, and Andhra Pradesh. These projects are expected to create 2,034 direct skilled jobs and support the wider electronics manufacturing sector through indirect employment.
With these approvals, the total number of projects sanctioned under the India Semiconductor Mission (ISM) has reached 10, with a combined investment of approximately INR 1.6 trillion across six states. The new facilities will address demand from sectors including telecom, automotive, data centres, consumer electronics, and industrial electronics.
SiCSem Private Limited, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish an integrated Silicon Carbide-based compound semiconductor facility in Info Valley, Bhubaneswar, Odisha. The plant will have an annual capacity of 60,000 wafers and packaging capability for 96 million units, serving applications such as defence equipment, electric vehicles, railways, chargers, data centres, appliances, and solar power inverters.
3D Glass Solutions Inc. will also set up operations in Info Valley, Bhubaneswar, with a vertically integrated advanced packaging and embedded glass substrate unit. The facility will have an annual production capacity of around 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration modules, intended for use in defence, high-performance computing, artificial intelligence, RF and automotive sectors, photonics, and co-packaged optics.
Advanced System in Package Technologies (ASIP) will establish a unit in Andhra Pradesh in partnership with APACT Co. Ltd., South Korea. This facility will produce up to 96 million units annually for applications in mobile phones, set-top boxes, automotive systems, and other electronics.
Continental Device India Private Limited (CDIL) will expand its Mohali, Punjab plant to manufacture high-power discrete devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors in both silicon and silicon carbide. The expansion will increase its capacity to about 158.38 million units per year, targeting applications in automotive electronics, renewable energy, power conversion, industrial systems, and communication infrastructure.
According to the announcement, the projects include India’s first commercial compound semiconductor fabrication plant and an advanced glass-based substrate semiconductor packaging unit.
SiCSem, 3D Glass Solutions, ASIP Technologies, and Continental Device India operate in the semiconductor manufacturing sector, producing a range of devices and components for industries including defence, automotive, consumer electronics, and renewable energy.