L&T Technology Services has entered into a multi-year membership agreement with the MIT Media Lab to collaborate on research in artificial intelligence (AI), mobility, and sustainability. The agreement allows LTTS to participate in discussions and information exchange within the Media Lab’s cross-disciplinary research ecosystem.
As part of the collaboration, LTTS plans to connect its engineering and AI expertise with the Media Lab’s research programmes to explore applications such as agentic AI, early roadmaps for artificial general intelligence (AGI), and sustainable engineering solutions. LTTS will also host its industry programmes, including the Digital Engineering Awards and Advisory Council meetings, at the Media Lab.
“We are delighted to join the MIT Media Lab, a dynamic and creative interdisciplinary research sandbox,” said Amit Chadha, CEO & Managing Director, L&T Technology Services. “This collaboration underscores LTTS’ commitment to pushing the boundaries of engineering excellence. From exploring Agentic AI to early AGI application roadmaps, we are setting a course to shape the future of industries reliant on Mobility, Sustainability and Tech.”
“At the MIT Media Lab, we thrive on relationships that bring together bold industry leaders with our community of researchers,” said Jessica Rosenworcel, Executive Director of the MIT Media Lab. “Collaborating with LTTS opens exciting opportunities to engage with AI, data, and design thinking in addressing real-world challenges in mobility, sustainability, and technology.”
L&T Technology Services (LTTS) is a listed subsidiary of Larsen & Toubro. The company provides design, development, testing, and sustenance services across industrial products, medical devices, transportation, telecom & hi-tech, and process industries. Headquartered in India, LTTS serves 69 Fortune 500 companies and 57 engineering research and development (ER&D) firms. As of June 30, 2025, it employed over 23,600 people across 23 global design centres, 30 sales offices, and 105 innovation labs.
