RRP Electronics Limited has formed a strategic alliance with US-based Deca Technologies, Inc. to advance its semiconductor packaging capabilities. This collaboration aims to integrate Deca’s wafer-level chip-scale packaging (WLCSP) and M-Series™ fan-out wafer-level packaging (FOWLP) technologies into RRP Electronics’ assembly and testing operations.
As part of this partnership, RRP Electronics plans to invest in a Technology Transfer License Agreement (TTLA) with Deca, with qualification testing expected to conclude by August 2025. The company anticipates generating over USD 30 million (approximately ₹260 crore) in revenue during the second year of operations.
In addition to this alliance, RRP Electronics is developing an Outsourced Semiconductor Assembly and Test (OSAT) facility in Maharashtra, with a total investment of ₹24,000 crore. The first phase involves establishing a 40,000 sq.ft. packaging facility at Mahape, operational since September 16, 2024. The second phase includes adding more production lines at a new plant in MIDC, Taloja, expected to be operational within the next two years. This project is projected to create approximately 4,000 jobs, contributing to the local economy and positioning Maharashtra as a significant player in the global semiconductor market.
RRP Electronics is also collaborating with Swiss design company HMT Zurich to produce sophisticated application-specific integrated circuits (ASICs) in quad flat no-lead (QFN) packages. This partnership aims to enhance RRP’s capabilities in semiconductor manufacturing.
Deca Technologies specializes in advanced packaging solutions and is supported by investors such as Qualcomm, Infineon, and ASE Group. This alliance is expected to expand Deca’s technology ecosystem while supporting RRP Electronics’ growth in semiconductor manufacturing.