RRP Electronics Ltd has unveiled Maharashtra’s first OSAT (Outsourced Semiconductor Assembly and Test)/ATMP (Assembly, Testing, Marking, and Packaging) semiconductor manufacturing facility in Navi Mumbai, marking a major milestone in India’s quest for semiconductor self-reliance.
The inauguration ceremony was graced by prominent leaders, including Maharashtra Chief Minister Eknath Shinde, Deputy Chief Ministers Devendra Fadnavis and Ajit Pawar, along with Uday Samant, Minister of Industries, and Harshdeep Kamble, Principal Secretary of Industries, Government of Maharashtra. Distinguished guests such as Bharat Ratna awardee and cricket icon Sachin Tendulkar, and Anil Kakodkar, Padma Vibhushan awardee and former Chairman of the Department of Atomic Energy, also attended the event.
In collaboration with HMT Microelectronic AG and other industry leaders, this state-of-the-art facility aims to revolutionize India’s semiconductor sector. It is equipped to handle advanced packaging technologies, including QFN, BGA, SoC, and mixed ASICs.
Initially, the facility has the capacity to produce 10,000 wafers monthly, with ambitious plans to expand into a design house and develop cutting-edge LiDAR technology. This expansion will cater to the increasing demand for automotive power chips and the production of TFT and WATN components used in the automotive industry.
A Memorandum of Understanding (MoU) was signed between HMT Microelectronic AG and Renowa Vision Inc. The agreement with HMT focuses on projects related to QFN, BGA, and ASICs, with a planned extension into LiDAR technology. The partnership with Renowa Vision is a significant milestone for RRP, enabling the acquisition of technology for OSAT and FAB processes for NAND memory chips—non-volatile storage solutions that retain data without power.
These strategic partnerships are expected to generate over USD 50 million in revenue for RRP in the OSAT sector, solidifying its position in the global semiconductor industry.