izmo Microsystems Private Limited announced on 16 March 2026 that it has signed a memorandum of understanding (MoU) with Switzerland-based CCRAFT SA and Spain-based Alcyon Photonics SL to jointly design, produce, and commercialise photonic integrated circuit (PIC) systems for datacom, telecom, aerospace, and sensor markets. The agreement establishes a framework for collaboration across chip design, foundry manufacturing, and semiconductor packaging to support the development of silicon photonics solutions.
According to a press release issued by izmo Limited, the partnership combines specialised capabilities across the photonics value chain. CCRAFT operates an ISO-certified 150 mm wafer foundry producing thin-film lithium niobate (TFLN) photonic chips, enabling electro-optic modulators exceeding 400 Gbit/s, while Alcyon Photonics provides fabrication-ready photonic integrated circuit designs and architecture libraries intended to accelerate the transition from prototype to production.
izmo Microsystems will contribute semiconductor packaging and co-packaged optics capabilities within the collaboration. The company operates a Class 1000 cleanroom facility in Bengaluru with capabilities including three-dimensional die stacking, flip-chip assembly, fine-pitch wire bonding, and photonics packaging processes such as optical alignment, fibre attachment, hermetic sealing, and system-level testing.
“Silicon photonics is the critical infrastructure layer that will determine how effectively the world deploys AI and scales next-generation communication networks,” said Dinanath Soni, Director, izmo Microsystems Private Limited. “By combining CCRAFT’s world-class TFLN foundry capabilities and Alcyon’s proven IP design expertise with our advanced packaging infrastructure in India, we are creating a genuinely differentiated end-to-end photonics value chain.”
Under the MoU, the companies will collaborate on delivering Alcyon’s photonic IP libraries to customers, jointly designing and producing photonic systems, and commercialising solutions developed through the partnership. izmomicro has been designated as a preferred packaging partner and will provide design guidelines to optimise photonic integrated circuits for advanced packaging during early development stages.
The press release noted that industry research estimates the global silicon photonics market at approximately USD 2–3 billion in 2025 and projects compound annual growth of 25–30 percent, with the addressable market estimated at USD 10–22 billion by the early 2030s and potentially exceeding USD 28 billion by 2034. Data centres and high-performance computing account for more than 70 percent of demand, with optical transceivers at 400G, 800G, and 1.6T increasingly used as copper-based interconnects approach physical limits.
izmo Microsystems Private Limited is the semiconductor packaging subsidiary of izmo Limited, a Bengaluru-based company listed on the National Stock Exchange of India and the Bombay Stock Exchange. The company provides semiconductor packaging services including system-in-package (SiP), integrated circuit packaging, silicon photonics packaging, radio frequency and microwave assembly, and co-packaged optics.
